Packaging technology of SMD COB GOB small pitch LED display screen

SMD (surface mount)  or COB GOB (surface mount) packaging led display screen is to solder single or multiple LED chips on the metal bracket with plastic cup-shaped frame (the outer pins of the bracket are respectively connected with the P and N levels of LED chips), and then pour liquid ring into the plastic frame

Packaging technology of small space LED display screen
1. Surface mount (SMD)
Surface mount (SMD) packaging is to solder a single or multiple LED chips on a metal bracket with a plastic cup-shaped outer frame (the outer pins of the bracket are respectively connected with the P and N levels of the LED chips), then pour liquid epoxy resin or organic silica gel into the plastic outer frame, then bake it at high temperature, and then cut it into a single surface mount packaging device.
2. New integrated packaging technology IMD (four in one)
LED display enterprise Chenzhi Technology Co cathode display has a deep technical precipitation on SMD mounting process, and “four in one” packaging is a further development on the basis of SMD packaging inheritance. SMD package contains one pixel in one package structure, while “four in one” package contains four pixels in one package structure. Although the four in one LED display adopts the new integrated packaging technology IMD (four in one), its processing technology still uses the surface mount processing technology“ The “four in one” mini LED module IMD package combines the advantages of SMD and cob, and solves the problems of ink color divergence, splicing seam, light leakage and maintenance. It has the characteristics of high specific illumination, high integration, easy maintenance and low cost. It is the most suitable planning scheme on the road to smaller spacing. Currently, the “four in one” mini LED module is based on the consideration of cost, and it adopts the formal chip. As the packaging manufacturers make more requests for chips, they will further launch the “six in one” or “n in one” plan.
3. Cob packaging technology
COB package is a kind of device that adheres the bare chip to the interconnection substrate with conductive or non-conductive adhesive, and then stops wire bonding to complete the electrical connection. COB package adopts integrated package technology, because it saves a single LED device, and then the chip processing technology is used after package. It can deal with the SMD packaging display reasonably. Because the point spacing is reduced from time to time, the processing difficulty is increased, the yield is reduced, and the cost is increased. Cob is easier to complete the small spacing.